Friday, March 26, 2010

NexPlanar Gets $3.5M In Venture Debt Funding

Hillsboro, Oregon-based NexPlanar, a developer of chemical mechanical planarization (CMP) pads for the semiconductor industry, has raised $3.5M in a venture debt round, according to funding provider ATEL Ventures. According to ATEL, the funding round will be used for capacity expansion at NexPlanar to support increased customer demand. NexPlanar has previously raised equity funding from BlueRun Ventures, InterWest Partners, SmartForest Venturse, Fina Ventures, Intel Capital, and Entegris.