Friday, January 29, 2010

TriQuint Hits 100M Flip Chip Shipments

Hillsboro-based TriQuint Semiconductor, a developer of RF front end semiconductors, noted this morning that it has hit shipments of 100 million units of its flip chip interconnect technology, CuFlip. The firm said the biggest volume on the device is on its TQM7M5012, a PA module used on consumer smart phones, data cards, netbooks, e-readers, and other mobile devices. The firm said the interconnect technology helps enhance performance, reliability, and manufacturing scalability for customers using the component.